Integrated circuit packaging is the final stage of semiconductor device fabrication. It is followed by testing. The die (integrated circuit), which represents the core of the device, is encased in a supporting case that prevents physical damage and corrosion and supports the electrical contacts required to assemble the integrated circuit into a system.
In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Sometimes it is called encapsulation or seal, appropriating the name of packaging's final step. Confusion sometimes arises, because the term electronic packaging generally includes the later stages of mounting and interconnecting the devices, for example on printed-circuit boards.
Read more about Integrated Circuit Packaging: Approaches, Operations
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