Operations
The following operations are performed at the stage of packaging.
Die attachment is the step during which a die is mounted and fixed to the package or support structure (header). For high-powered applications, the die is usually eutectic bonded onto the package, using e.g. gold-tin or gold-silicon solder (for good heat conduction). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy adhesive.
- IC Bonding
- Wire bonding
- Thermosonic Bonding
- Down bonding
- Tape-automated bonding
- Flip chip
- Quilt packaging
- Tab bonding
- Film attaching
- Spacer attaching
- IC encapsulation
- Baking
- Plating
- Lasermarking
- Trim and form
- Wafer bonding
Read more about this topic: Integrated Circuit Packaging
Famous quotes containing the word operations:
“You can’t have operations without screams. Pain and the knife—they’re inseparable.”
—Jean Scott Rogers. Robert Day. Mr. Blount (Frank Pettingell)
“It may seem strange that any road through such a wilderness should be passable, even in winter, when the snow is three or four feet deep, but at that season, wherever lumbering operations are actively carried on, teams are continually passing on the single track, and it becomes as smooth almost as a railway.”
—Henry David Thoreau (1817–1862)
“A sociosphere of contact, control, persuasion and dissuasion, of exhibitions of inhibitions in massive or homeopathic doses...: this is obscenity. All structures turned inside out and exhibited, all operations rendered visible. In America this goes all the way from the bewildering network of aerial telephone and electric wires ... to the concrete multiplication of all the bodily functions in the home, the litany of ingredients on the tiniest can of food, the exhibition of income or IQ.”
—Jean Baudrillard (b. 1929)