Evolution in Fabrication
As time progressed, the process used to fabricate the Pentium Pro processor die and its separate cache memory die changed, leading to a combination of processes used in the same package:
- The 133 MHz Pentium Pro prototype processor die was fabricated in a 0.6 µm BiCMOS process.
- The 150 MHz Pentium Pro processor die was fabricated in a 0.50 µm BiCMOS process.
- The 166, 180, and 200 MHz Pentium Pro processor die was fabricated in a 0.35 µm BiCMOS process.
- The 256 KiB L2 cache die was fabricated in a 0.50 µm BiCMOS process.
- The 512 and 1024 KiB L2 cache die was fabricated in a 0.35 µm BiCMOS process.
Read more about this topic: Pentium Pro
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