Design Methodology
While slower than x86 CPUs being sold by AMD and Intel, both in absolute terms and on a clock for clock basis, VIA's chips are much smaller, cheaper to manufacture, and lower power. This makes them highly attractive in the embedded marketplace, and increasingly in the mobile sector as well.
This has also enabled VIA to continue to scale the frequencies of their chips with each manufacturing process die shrink, while competitive products from Intel (such as the P4 Prescott) have encountered severe thermal management issues, although the new Intel Core generation of chips are substantially cooler.
To this extent, the performance gap that used to exist between VIA and competing x86 chips is still wide, but starting to narrow. Some of the design trade offs made by the VIA design team are worthy of study, as they run contrary to accepted wisdom.
Read more about this topic: VIA C3
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