Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Device Fabrication
Famous quotes containing the words die and/or preparation:
““I am willing to die for my country” is a variant of “I am willing to kill for my country.””
—Mason Cooley (b. 1927)
“It’s sad but true that if you focus your attention on housework and meal preparation and diapers, raising children does start to look like drudgery pretty quickly. On the other hand, if you see yourself as nothing less than your child’s nurturer, role model, teacher, spiritual guide, and mentor, your days take on a very different cast.”
—Joyce Maynard (20th century)