Die Preparation
Once tested, a wafer is typically reduced in thickness
before the wafer is scored and then broken into individual die -- wafer dicing.
Only the good, unmarked chips go on to be packaged.
Read more about this topic: Semiconductor Device Fabrication
Famous quotes containing the words die and/or preparation:
“Someone who is about to die does not mourn the dead.”
—Friedrich Dürrenmatt (1921–1990)
“Living each day as a preparation for the next is an exciting way to live. Looking forward to something is much more fun than looking back at something—and much more constructive. If we can prepare ourselves so that we never have to think, “Oh, if I had only known, if I had only been ready,” our lives can really be the great adventure we so passionately want them to be.”
—Hortense Odlum (1892–?)