Advantages
This package offers variety of benefits including reduced lead inductance, a small sized "near chip scale" footprint, thin profile and low weight. It also uses perimeter I/O pads to ease PCB trace routing, and the exposed copper die-pad technology offers good thermal and electrical performance. These features make the QFN an ideal choice for many new applications where size, weight, and thermal and electrical performance are important.
Read more about this topic: Quad-flat No-leads Package
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—Ralph Waldo Emerson (1803–1882)
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